Ti ni Ag
PDF | The dissolution and interfacial reactions involving thin-film Ti/Ni/Ag metallizations on two semiconductor devices, diode and... | Find, read and cite ... ,XPS technique. In the Ti/Ni/Au metal the Ni diffusion through the Au layer was observed, while in the. Ti/Ni/Ag metal Ni was not found on the silver surface ... ,由 A Scandurra 著作 · 1994 · 被引用 5 次 — Ti/Ni/Ag was found to be sensitive to contamination from elements such as sulphur and chlorine found on the silver surface after thermal treatment, while Ti/Ni ... ,由 G Ghosh 著作 · 2001 · 被引用 145 次 — A schematic cross section of a diode solder joint, employing the Ti/Ni/Ag metallization scheme, is shown in Fig. 1. It is important to note that ... ,Abstract The interface structure and the adhesion of direct current (DC) sputtered Ti/Ni/Ag thin film metallization on n + Si substrate has been ... ,The interface structure and the adhesion of direct current (DC) sputtered Ti/Ni/Ag thin film metallization on n+Si substrate has been investigated. ,2018年7月24日 — Ti/Ni/Ag/Ni沈積後，藉由Cross Section觀察，銀的厚度達13.16um. 應用範圍. 現有厚度組合：10~15um己量產，可依客戶需求進行厚度調整；16~50um開發 ... ,論文名稱(外文):, Investigations on the Interfacial Interaction of Ti/Ni/Ag/Au Multilayers Metallization under Thermal Cycling Test. 指導教授: 林光隆. ,2018年7月24日 — 現有金屬組合： Ti / Ni / Ag、 Ti / Ni / Ti / Ag、 Ti / Ni / Ag / Ni、 Ti / Ni / Ag / Sn，可依客戶需求進行厚度調整。 適用六吋、八吋、N型、P型 ...
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 Ti ni Ag 相關參考資料
(PDF) Dissolution and interfacial reactions of thin-film TiNiAg ...
PDF | The dissolution and interfacial reactions involving thin-film Ti/Ni/Ag metallizations on two semiconductor devices, diode and... | Find, read and cite ... https://www.researchgate.net Characterization and reliability of TiNi ... - Wiley Online Library
XPS technique. In the Ti/Ni/Au metal the Ni diffusion through the Au layer was observed, while in the. Ti/Ni/Ag metal Ni was not found on the silver surface ... http://onlinelibrary.wiley.com Characterization and reliability of TiNiAu, TiNiAg and TiNi ...
由 A Scandurra 著作 · 1994 · 被引用 5 次 — Ti/Ni/Ag was found to be sensitive to contamination from elements such as sulphur and chlorine found on the silver surface after thermal treatment, while Ti/Ni .... https://analyticalsciencejourn Dissolution and interfacial reactions of thin-film TiNiAg ...
由 G Ghosh 著作 · 2001 · 被引用 145 次 — A schematic cross section of a diode solder joint, employing the Ti/Ni/Ag metallization scheme, is shown in Fig. 1. It is important to note that ... https://www.sciencedirect.com Investigation of interface properties of TiNi ... - Semantic Scholar
Abstract The interface structure and the adhesion of direct current (DC) sputtered Ti/Ni/Ag thin film metallization on n + Si substrate has been ... https://www.semanticscholar.or Investigation of interface properties of TiNiAg ... - ResearchGate
The interface structure and the adhesion of direct current (DC) sputtered Ti/Ni/Ag thin film metallization on n+Si substrate has been investigated. https://www.researchgate.net 厚銀製程(Thick Ag Process) - iST宜特
2018年7月24日 — Ti/Ni/Ag/Ni沈積後，藉由Cross Section觀察，銀的厚度達13.16um. 應用範圍. 現有厚度組合：10~15um己量產，可依客戶需求進行厚度調整；16~50um開發 ... https://www.istgroup.com 轉寄 - 博碩士論文行動網
論文名稱(外文):, Investigations on the Interfacial Interaction of Ti/Ni/Ag/Au Multilayers Metallization under Thermal Cycling Test. 指導教授: 林光隆. https://ndltd.ncl.edu.tw 金屬蒸鍍沈積(Metal Evaporation for Backside Metallization)
2018年7月24日 — 現有金屬組合： Ti / Ni / Ag、 Ti / Ni / Ti / Ag、 Ti / Ni / Ag / Ni、 Ti / Ni / Ag / Sn，可依客戶需求進行厚度調整。 適用六吋、八吋、N型、P型 ... https://www.istgroup.com |