high accuracy die bonder
This machine is capable to perform multi-die bonding of up to +/- 1.5μm@3s placement accuracy on singulated submounts by using eutectic bonding method. ,A fully automated all-purpose system built on a sophisticated granite gantry and high precision motion control system. T-6000-L/G can be upgraded with new ... ,Fully automatic high accuracy die bonders that are capable of epoxy and eutectic die bonding are the lifeblood of the modern semiconductor industry. ,This is high-accuracy thermo-compression (TC) bonder for chip on board (CoB) packaging. Laser heat bonding process is performed by the equipped laser heater ... ,Main Specs ; Bonding Speed, 0.5sec/cycle ; Bonding Accuracy, XY : ±10μm,3σ θ : ±0.05°,3σ ; Die Size, Ø5.0-25.0mm t＝30μm- ; Substrate Size, Length : 100–300 mm ,The iStack™ S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. ,Higher Accuracy Die Bonder DB850H. 商品簡述：. Key Features. Higher accouracy Die Bonder to Support state of the art memory package. 更多產品資料. ,ASMPT AMICRA's highly accurate die bonder / flip chip bonder system (+/-1.0 μm), with multi-chip capability, a modular machine concept and much more! ,提供高精度黏晶(Die bonding)服務，包括晶粒挑揀、點膠黏晶、覆晶封裝(Flip chip bonding)、共金黏晶等多項服務。
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 high accuracy die bonder 相關參考資料
CoS Die Bonder: High-precision chip-on-substrate bonding
This machine is capable to perform multi-die bonding of up to +/- 1.5μm@3s placement accuracy on singulated submounts by using eutectic bonding method. https://amicra.semi.asmpt.com Die Bonder
A fully automated all-purpose system built on a sophisticated granite gantry and high precision motion control system. T-6000-L/G can be upgraded with new ... https://www.bondtronics.com.tw Die bonding solutions
Fully automatic high accuracy die bonders that are capable of epoxy and eutectic die bonding are the lifeblood of the modern semiconductor industry. https://www.mycronic.com FDB250 Flip Chip Bonder High-Accuracy Die Bonder
This is high-accuracy thermo-compression (TC) bonder for chip on board (CoB) packaging. Laser heat bonding process is performed by the equipped laser heater ... https://www.shibuya.co.jp High-accuracy & High Production die bonder for Stacked ...
Main Specs ; Bonding Speed, 0.5sec/cycle ; Bonding Accuracy, XY : ±10μm,3σ θ : ±0.05°,3σ ; Die Size, Ø5.0-25.0mm t＝30μm- ; Substrate Size, Length : 100–300 mm https://www.komachine.com High-accuracy die bonder - All industrial manufacturers
The iStack™ S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. https://www.directindustry.com Higher Accuracy Die Bonder<BR>DB850H
Higher Accuracy Die Bonder DB850H. 商品簡述：. Key Features. Higher accouracy Die Bonder to Support state of the art memory package. 更多產品資料. https://www.jipal.com Nova Plus - Die Bonder and Flip Chip Bonder
ASMPT AMICRA's highly accurate die bonder / flip chip bonder system (+/-1.0 μm), with multi-chip capability, a modular machine concept and much more! https://amicra.semi.asmpt.com 高精度多功能黏晶DieBonding
提供高精度黏晶(Die bonding)服務，包括晶粒挑揀、點膠黏晶、覆晶封裝(Flip chip bonding)、共金黏晶等多項服務。 https://www.istgroup.com |