Spil BGA
EBGA is a cavity down, thermally enhanced BGA with laminated substrate. They are suitable solutions for high power dissipation applications (> 6W). ,EDHS-BGA. Exposed Drop-in Heat Sink BGA. Siliconware's EDHS-BGA is a unique low cost solution for medium power applications (3-5W). With traditional ... ,The package offers ball counts in excess of 2597 with higher electrical performance compared to the traditional BGA package. Siliconware offers the flip chip ... ,PBGA. Plastic Ball Grid Array. PBGA is a die-up design, plastic overmolded BGA using 2, 4 or 6 layer BT substrate and 0.8 or 1.0 or 1.27mm ball pitch and above ... ,The Siliconware BGA line-up includes cavity-up and cavity-down designs utilizing advanced substrate technologies. What is a BGA Package? The Ball Grid Array ( ... ,23, 2020. Home > Products > CSP > TFBGA / VFBGA · BGA · EDHS-BGA · Flip Chip Packages · PBGA · CSP · FC-CSP · LGA · QFN · TFBGA / VFBGA · WLCSP ... ,Siliconware's Multi-Package BGA provides an alternative multi-chip module solution when know-good-die, KGD, is not feasible. Multiple chips are integrated ... ,Siliconware Stacked die packages are continuously being upgraded to meet these demands... Siliconware's Multi-Package BGA provides an alternative multi-chip ... ,Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. It allows ... ,BGA · EDHS-BGA · Flip Chip Packages · PBGA · CSP · FC-CSP · LGA · QFN · TFBGA / VFBGA · WLCSP · Stacked Die · Multi-Package · Quad & Dual. Quad. QFP.
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 Spil BGA 相關參考資料
Products - BGA - EBGA - SPIL
EBGA is a cavity down, thermally enhanced BGA with laminated substrate. They are suitable solutions for high power dissipation applications (> 6W). https://www.spil.com.tw Products - BGA - EDHS-BGA - SPIL
EDHS-BGA. Exposed Drop-in Heat Sink BGA. Siliconware's EDHS-BGA is a unique low cost solution for medium power applications (3-5W). With traditional ... https://www.spil.com.tw Products - BGA - Flip Chip Packages - SPIL
The package offers ball counts in excess of 2597 with higher electrical performance compared to the traditional BGA package. Siliconware offers the flip chip ... https://www.spil.com.tw Products - BGA - PBGA - SPIL
PBGA. Plastic Ball Grid Array. PBGA is a die-up design, plastic overmolded BGA using 2, 4 or 6 layer BT substrate and 0.8 or 1.0 or 1.27mm ball pitch and above ... https://www.spil.com.tw Products - BGA - SPIL
The Siliconware BGA line-up includes cavity-up and cavity-down designs utilizing advanced substrate technologies. What is a BGA Package? The Ball Grid Array ( ... https://www.spil.com.tw Products - CSP - TFBGA VFBGA - SPIL
23, 2020. Home > Products > CSP > TFBGA / VFBGA · BGA · EDHS-BGA · Flip Chip Packages · PBGA · CSP · FC-CSP · LGA · QFN · TFBGA ... https://www.spil.com.tw Products - Multi-Package - SPIL
Siliconware's Multi-Package BGA provides an alternative multi-chip module solution when know-good-die, KGD, is not feasible. Multiple chips are integrated ... https://www.spil.com.tw Products - SPIL
Siliconware Stacked die packages are continuously being upgraded to meet these demands... Siliconware's Multi-Package BGA provides an alternative multi-chip ... https://www.spil.com.tw Technology - SPIL
Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. It allows ... https://www.spil.com.tw 網站導覽 - SPIL
BGA · EDHS-BGA · Flip Chip Packages · PBGA · CSP · FC-CSP · LGA · QFN · TFBGA / VFBGA · WLCSP · Stacked Die · Multi-Package... https://www.spil.com.tw |