wafer arcing defect
The defect of interest is molten tungsten (W) balls which are generated in a ... the arc crater in dielectric etching, but spray out over the surface of the wafer in ... ,Backend Dielectric Etch Induced Wafer Arcing Mechanism and Solution ... defect, ECP bevel clean W B R ARCING CONTROL PARAMETERS As wafer arcing is ... ,The particles resulting from micro-arcing cause wafer contamination and yield loss. Figure 2 shows typical wafer maps of un-patterned wafer defect inspection ... ,Abstract: This paper presents a method to mitigate arcing defect encountered at pad etch. The problem was detected during wafer disposition due to equipment ... ,Arcing is a severe issue common to CVD processing. Minor arcing can generate particles/defects. Severe arcing can completely destroy wafers and reactor ... , 論文名稱(外文):, An Improvement on Wafer Edge Defects & Arcing Issues Reductions in Etching Processes. 指導教授: 蘇德仁 · 蘇德仁引用關係.,論文之主題是PECVD 沉積薄膜因Wafer Arcing 造成沉積薄膜厚度不均. 而導致IC 良率下降。CVD 製程中會遇到許多問題如微粒Particle，薄膜厚度之. 一致性，沉積 ...
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 wafer arcing defect 相關參考資料
A case study on severe yield loss caused by wafer arcing in BEOL ...
The defect of interest is molten tungsten (W) balls which are generated in a ... the arc crater in dielectric etching, but spray out over the surface of the wafer in ... https://ieeexplore.ieee.org Backend Dielectric Etch Induced Wafer Arcing Mechanism and ...
Backend Dielectric Etch Induced Wafer Arcing Mechanism and Solution ... defect, ECP bevel clean W B R ARCING CONTROL PARAMETERS As wafer arcing is ... https://wenku.baidu.com Micro-Arcing During High-Density Plasma ... - Applied Materials
The particles resulting from micro-arcing cause wafer contamination and yield loss. Figure 2 shows typical wafer maps of un-patterned wafer defect inspection ... http://www.appliedmaterials.co Mitigating arcing defect at pad etch - IEEE Conference Publication
Abstract: This paper presents a method to mitigate arcing defect encountered at pad etch. The problem was detected during wafer disposition due to equipment ... https://ieeexplore.ieee.org Solving Arcing Issues in CVD Processes
Arcing is a severe issue common to CVD processing. Minor arcing can generate particles/defects. Severe arcing can completely destroy wafers and reactor ... http://ecst.ecsdl.org 半導體蝕刻製程中晶周缺陷及電弧現象改善之研究 - 臺灣博碩士論文檢索
論文名稱(外文):, An Improvement on Wafer Edge Defects & Arcing Issues Reductions in Etching Processes. 指導教授: 蘇德仁 · 蘇德仁引用關係. https://ndltd.ncl.edu.tw 第一章緒論 - 國立交通大學機構典藏
論文之主題是PECVD 沉積薄膜因Wafer Arcing 造成沉積薄膜厚度不均. 而導致IC 良率下降。CVD 製程中會遇到許多問題如微粒Particle，薄膜厚度之. 一致性，沉積 ... https://ir.nctu.edu.tw |