package outline jedec
Design Requirements - Ball Grid Array Package (BGA). DR-4.14J.01. Published: Feb 2019. Item 11.2-948E. Committee(s): JC-11.2. JEP95 Registrations Main ... ,Annexes. A. Derivation of basic package designators and common names (normative). 10. A.1. Package outline style codes. 10. A.2 Terminal-position prefix. 10. , Small Outline (SO) Package Family 8.4 mm Body Width (Plastic). MO-060 .040” 132 Pin Quad Flatpack. MO-061. Plastic Small Outline J-Lead ...,See "ball-grid array", "can package", "chip carrier", "chip‑scale package", "clamped ... "small‑outline package", "special-shape package", "stud-mount package", ... ,JEP95, JEDEC Registered and Standard Outlines for Solid State and ... DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric ... ,Registration - Thin Small Outline Package (Type I). S-PDSO-G/TSOP. Correction of the L min value from 0.05 mm to 0.50 mm. Item 11.1-583E ... ,A surface-mount package that conforms to the "small‑outline" concept and has the leads formed into a "J" configuration. References: JESD21-C, 1/97 ... ,A package whose chip cavity or mounting area occupies a major fraction of the package area and whose terminals are on one or two (normally opposite) sides ... ,Transistor Outlines Archive. If there is not a link, JEDEC may not have the electronic file. Contact [email protected] for assistance. TO-1 · TO-2 · TO-3; TO-4; TO-5 ...
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 package outline jedec 相關參考資料
Design Requirements - Ball Grid Array Package (BGA) | JEDEC
Design Requirements - Ball Grid Array Package (BGA). DR-4.14J.01. Published: Feb 2019. Item 11.2-948E. Committee(s): JC-11.2. JEP95 Registrations Main ... https://www.jedec.org JEDEC STANDARD
Annexes. A. Derivation of basic package designators and common names (normative). 10. A.1. Package outline style codes. 10. A.2 Terminal-position prefix. 10. https://www.jedec.org outline - JEDEC
Small Outline (SO) Package Family 8.4 mm Body Width (Plastic). MO-060 .040” 132 Pin Quad Flatpack. MO-061. Plastic Small Outline J-Lead ... https://www.jedec.org package | JEDEC
See "ball-grid array", "can package", "chip carrier", "chip‑scale package", "clamped ... "small‑outline package", "special-shape package&quo... https://www.jedec.org Registered Outlines: JEP95 | JEDEC
JEP95, JEDEC Registered and Standard Outlines for Solid State and ... DIPS, chip carriers, sockets, and package interface BGA outlines in both inch and metric ... https://www.jedec.org Registration - Thin Small Outline Package (Type I). S ... - JEDEC
Registration - Thin Small Outline Package (Type I). S-PDSO-G/TSOP. Correction of the L min value from 0.05 mm to 0.50 mm. Item 11.1-583E ... https://www.jedec.org small-outline J-lead (package) (SOJ) | JEDEC
A surface-mount package that conforms to the "small‑outline" concept and has the leads formed into a "J" configuration. References: JESD21-C, 1/97 ... https://www.jedec.org small-outline package | JEDEC
A package whose chip cavity or mounting area occupies a major fraction of the package area and whose terminals are on one or two (normally opposite) sides ... https://www.jedec.org Transistor Outlines Archive | JEDEC
Transistor Outlines Archive. If there is not a link, JEDEC may not have the electronic file. Contact [email protected] for assistance. TO-1 · TO-2 · TO-3; TO-4; TO-5 ... https://www.jedec.org |