die seal ring structure
The die seal ring structure 101 comprises a continuous barrier of metals formed by all the conductive layers within the die, including contacts, metals and vias. ,2019年6月5日 — [0003] A seal ring is generally formed between scribe lines and integrated circuits of each die on a wafer, and the seal ring is formed by ... ,The seal ring structure includes a metallization layer, having a bridge sublevel and a plug sublevel. An upper-level bridge is formed on the bridge sublevel at ... ,依據本發明之較佳實施例,是揭露一種切割道結構,其包含一半導體基底,該半導體基底上定. 義有一晶粒區、一晶粒封環(die seal ring)區設於該晶粒區外圍、一切割道區設於該晶粒 ... ,A seal ring is formed in the inter-metal dielectric (IMD) layers of an IC die, enclosing an active circuit region. The real ring is formed prior to the ... ,由 SH Chen 著作 · 2005 · 被引用 12 次 — The seal- ring structure consists of the contact/via strip and metal layers surrounding the active area of the chip.,Download scientific diagram | Schematics of the seal ring structure and production process flow from publication: Advances in Manufacturing | Hermetic ... ,2024年3月21日 — The seal structures in accordance with embodiments may also guard against microcracking, delamination, moisture ingress, ion diffusion, etc. ,Each side of the ring is adjacent to a respective edge of the semiconductor chip. At least one of the plurality of vias has a width greater than about 70 ...
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 die seal ring structure 相關參考資料
US20110241182A1 - Die seal ring - Google Patents
The die seal ring structure 101 comprises a continuous barrier of metals formed by all the conductive layers within the die, including contacts, metals and vias. https://patents.google.com SEAL RING STRUCTURE, SEMICONDUCTOR DIE, AND ...
2019年6月5日 — [0003] A seal ring is generally formed between scribe lines and integrated circuits of each die on a wafer, and the seal ring is formed by ... https://data.epo.org Seal ring structure for integrated circuit chips
The seal ring structure includes a metallization layer, having a bridge sublevel and a plug sublevel. An upper-level bridge is formed on the bridge sublevel at ... https://patents.google.com 切割道結構及切割晶圓之方法 - Googleapis.com
依據本發明之較佳實施例,是揭露一種切割道結構,其包含一半導體基底,該半導體基底上定. 義有一晶粒區、一晶粒封環(die seal ring)區設於該晶粒區外圍、一切割道區設於該晶粒 ... https://patentimages.storage.g Forming Seal Ring in an Integrated Circuit Die
A seal ring is formed in the inter-metal dielectric (IMD) layers of an IC die, enclosing an active circuit region. The real ring is formed prior to the ... https://portal.unifiedpatents. Investigation on seal-ring rules for IC product ...
由 SH Chen 著作 · 2005 · 被引用 12 次 — The seal- ring structure consists of the contact/via strip and metal layers surrounding the active area of the chip. https://citeseerx.ist.psu.edu Schematics of the seal ring structure and ...
Download scientific diagram | Schematics of the seal ring structure and production process flow from publication: Advances in Manufacturing | Hermetic ... https://www.researchgate.net Seal Ring Designs Supporting Efficient Die to Die Routing
2024年3月21日 — The seal structures in accordance with embodiments may also guard against microcracking, delamination, moisture ingress, ion diffusion, etc. https://patents.justia.com Seal Ring Structure with Improved Cracking Protection
Each side of the ring is adjacent to a respective edge of the semiconductor chip. At least one of the plurality of vias has a width greater than about 70 ... https://portal.unifiedpatents. |