die bonder accuracy
This machine is capable to perform multi-die bonding of up to +/- 1.5μm@3s placement accuracy on singulated submounts by using eutectic bonding method. ,High Performance at High Accuracy. Highest accuracy ± 10 µm @ 3 Sigma (7 µm on request); High productivity, low cost-of-ownership ; Multi-Chip Capability. Single ... ,Equipped with linear motors and 0.1 µm resolution glass scales, this enables a movement precision of 8 µm. @ 3Sigma. A force range of 15 g up to 800 g, combined. ,Die Bonder 黏晶機 · 1.Machine cycle time : 0.5sec · 2.UPH : ~7K (depend on process) · 3.Accuracy : < 3um · 4.Bonding process : by flux, DAF, … · 5.Heating : 200°C~ ,The ACCµRA™100 is a semi-automatic flip-chip / Die bonder that guarantees ±0.5 µm placement accuracy. Its flexibility makes it ideal for developing a wide range ... ,The ACCμRA M is a manual Flip-Chip Bonder that permits to reach ± 3 μm post-bond accuracy. The only motorized axis is the arm, which controls precisely the ... ,Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. ,ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ... ,Discrete Application Die Bonder · Bonding accuracy ±20μm (3σ) · 10% increase in UPH compared with the conventional model ...
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 die bonder accuracy 相關參考資料
CoS Die Bonder: High-precision chip-on-substrate bonding
This machine is capable to perform multi-die bonding of up to +/- 1.5μm@3s placement accuracy on singulated submounts by using eutectic bonding method. https://amicra.semi.asmpt.com Datacon 2200 evo
High Performance at High Accuracy. Highest accuracy ± 10 µm @ 3 Sigma (7 µm on request); High productivity, low cost-of-ownership ; Multi-Chip Capability. Single ... https://www.besi.com Die Bonder
Equipped with linear motors and 0.1 µm resolution glass scales, this enables a movement precision of 8 µm. @ 3Sigma. A force range of 15 g up to 800 g, combined. https://www.bondtronics.com.tw Die Bonder 黏晶機
Die Bonder 黏晶機 · 1.Machine cycle time : 0.5sec · 2.UPH : ~7K (depend on process) · 3.Accuracy : < 3um · 4.Bonding process : by flux, DAF, … · 5.Heating : 200°C~ http://www.gmmcorp.com.tw Flip Chip Bonders - Setna
The ACCµRA™100 is a semi-automatic flip-chip / Die bonder that guarantees ±0.5 µm placement accuracy. Its flexibility makes it ideal for developing a wide range ... https://set-na.com High-accuracy die bonder - All industrial manufacturers
The ACCμRA M is a manual Flip-Chip Bonder that permits to reach ± 3 μm post-bond accuracy. The only motorized axis is the arm, which controls precisely the ... https://www.directindustry.com MRSI Systems MRSI-M3 3-Micron Die Bonder
Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. https://www.mycronic.com NANO - Die Bonder and Flip Chip Bonder
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5µm), a cycle time of <15 sec. as ... https://amicra.semi.asmpt.com STC-800 - 代理產品 - SKTI勝凱科技有限公司
Discrete Application Die Bonder · Bonding accuracy ±20μm (3σ) · 10% increase in UPH compared with the conventional model ... https://skti.com.tw |