afc amicra
Fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5μm), a cycle time of <15 sec.,ASMPT AMICRA 的AFCPlus 是目前市面上最先進的固晶系統之一。高達±1 µm @ 3σ 的固晶精度，同時還能承受在超過350°C 的溫度下進行固晶，並施加高強度的固晶力度，這種精密 ... ,ASMPT AMICRA's AFCPlus is one of the most advanced die bonding systems on the market today. It is uncommon to find a precision die bonder that can maintain ... ,產品特色及效益. 置放精度 ± 1μm/ 3S，超高置件精度，可對應日新月異的產品進化需求. 可對應覆晶基板，特殊對位方式，就算對位面無任何記號(Mark)，也可輕鬆達到高精度置件.,AMICRA MICROTECHNOLOGIES/ASM AFC是一種高度可靠的自動化半導體粘合器,具有先進的運動和溫度控制、ULTRAPRECISE® FTB和熱壓粘合能力,以及人工焊接和焊接等制造、組裝 ... ,AMICRA MICROTECHNOLOGIES AFC Plus是一款針對半導體行業需求而設計的先進的線鍵設備。該機器利用專有的光學檢測技術提供自動、高精度的粘結，吞吐量比傳統方法快50%。 ,ASMPT AMICRA GmbH is a worldwide leading supplier of ultra high precision Die Attach Equipment specializing in submicron placement accuracy. ,Key Features. ±0.5µM Placement accuracy; Cycle time <30sec; Flip-Chip option; Assembly of chip & micro-optics. WDM, optoelectronic components, micro-lenses, ...,ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5μm), a cycle time of <15 sec. ,ASM AMICRA 為一家專門致力於超高精度(Accruacy 0.2µm) 黏晶機開發的公司, 其產品可應用於半導體產業, 微機電產業, 光電產業及光纖通訊產業, 且廣受一線大廠採用.
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 afc amicra 相關參考資料
AFC Plus - Die Bonder and Flip Chip Bonder
Fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5μm), a cycle time of <15 sec. https://amicra.semi.asmpt.com AFC Plus - 固晶及覆晶機
ASMPT AMICRA 的AFCPlus 是目前市面上最先進的固晶系統之一。高達±1 µm @ 3σ 的固晶精度，同時還能承受在超過350°C 的溫度下進行固晶，並施加高強度的固晶力度，這種精密 ... https://semi.asmpt.com AMICRA AFC Plus
ASMPT AMICRA's AFCPlus is one of the most advanced die bonding systems on the market today. It is uncommon to find a precision die bonder that can maintain ... https://semi.asmpt.com AMICRA AFC Plus - Die bonder
產品特色及效益. 置放精度 ± 1μm/ 3S，超高置件精度，可對應日新月異的產品進化需求. 可對應覆晶基板，特殊對位方式，就算對位面無任何記號(Mark)，也可輕鬆達到高精度置件. http://www.schmidtek.com.tw AMICRA MICROTECHNOLOGIES ASM AFC 鍵和機 ...
AMICRA MICROTECHNOLOGIES/ASM AFC是一種高度可靠的自動化半導體粘合器,具有先進的運動和溫度控制、ULTRAPRECISE® FTB和熱壓粘合能力,以及人工焊接和焊接等制造、組裝 ... https://tw.caeonline.com AMICRA MICROTECHNOLOGIES AFC Plus 鍵和機 ...
AMICRA MICROTECHNOLOGIES AFC Plus是一款針對半導體行業需求而設計的先進的線鍵設備。該機器利用專有的光學檢測技術提供自動、高精度的粘結，吞吐量比傳統方法快50%。 https://tw.caeonline.com ASMPT AMICRA
ASMPT AMICRA GmbH is a worldwide leading supplier of ultra high precision Die Attach Equipment specializing in submicron placement accuracy. https://amicra.semi.asmpt.com PDP - Amicra AFC
Key Features. ±0.5µM Placement accuracy; Cycle time <30sec; Flip-Chip option; Assembly of chip & micro-optics. WDM, optoelectronic components, micro-lenses, ... http://www.pdpequipment.co.uk Products
ASMPT AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1.5μm), a cycle time of <15 sec. https://amicra.semi.asmpt.com 半導體黏晶機
ASM AMICRA 為一家專門致力於超高精度(Accruacy 0.2µm) 黏晶機開發的公司, 其產品可應用於半導體產業, 微機電產業, 光電產業及光纖通訊產業, 且廣受一線大廠採用. http://www.schmidtek.com.tw |