wfbga

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wfbga

http://www.microchip.com/packaging. Note: 169-Ball Very, Very Thin Fine Pitch Ball Grid Array (TN) - 11x11 mm Body [WFBGA]. B. A. 0.15 C. 0.15 C. (DATUM B). ,A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated .... VFBGA: Very Fine Pitch Ball Grid Array; WFBGA: Very Very Thin profile Fine Pitch Ball Grid Array. To make it easier to use ball grid array devices, ,Lingsen' WFBGA (Very-Very Fine Ball Grid Array) is the thinner. • package solution for mobile applications, All non-Pb (lead-free). • devices are RoHS compliant. ,VFBGA, 0.80~1.00mm, Very Thin Profile, Fine Solder Ball Pitch. WFBGA, 0.65~0.80mm, Very Very Thin Profile, Fine Solder Ball Pitch. UFBGA, 0.50~0.65mm ... ,(VFBGA), 0.80mm (WFBGA), 0.65mm (UFBGA) and and. 0.50mm (XFBGA) maximum thickness. • Laminate substrate-based package which enables 1, 2, 3. , Compliant with IEC 62474/ D9.00. Compliant to IEC 61249-2-21:2003. Semiconductor Device Type: SYX. 100 WFBGA 8x8x0.8mm SAC.,For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. Note: 128-Ball Very ... ,Lingsen' WFBGA (Very-Very Fine Ball Grid Array) is the thinner package solution for mobile applications, All non-Pb (lead-free) devices are RoHS compliant.

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wfbga 相關參考資料
169-Ball Very, Very Thin Fine Pitch Ball Grid Array - Microchip ...

http://www.microchip.com/packaging. Note: 169-Ball Very, Very Thin Fine Pitch Ball Grid Array (TN) - 11x11 mm Body [WFBGA]. B. A. 0.15 C. 0.15 C. (DATUM B).

https://www.microchip.com

Ball grid array - Wikipedia

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated .... VFBGA: Very Fine Pitch Ball Grid Array; WFBGA: Very Very Thin profile Fine Pitch Ball Grid Array....

https://en.wikipedia.org

Data Sheet - WFBGA

Lingsen' WFBGA (Very-Very Fine Ball Grid Array) is the thinner. • package solution for mobile applications, All non-Pb (lead-free). • devices are RoHS compliant.

http://www.lingsen.com.tw

FBGA - ASE Kaohsiung

VFBGA, 0.80~1.00mm, Very Thin Profile, Fine Solder Ball Pitch. WFBGA, 0.65~0.80mm, Very Very Thin Profile, Fine Solder Ball Pitch. UFBGA, 0.50~0.65mm ...

http://www.asekh.aseglobal.com

Fine Pitch Ball Grid Array - STATS ChipPAC

(VFBGA), 0.80mm (WFBGA), 0.65mm (UFBGA) and and. 0.50mm (XFBGA) maximum thickness. • Laminate substrate-based package which enables 1, 2, 3.

http://www.statschippac.com

Semiconductor Device Type: SYX 100 WFBGA 8x8x0.8mm SAC ...

Compliant with IEC 62474/ D9.00. Compliant to IEC 61249-2-21:2003. Semiconductor Device Type: SYX. 100 WFBGA 8x8x0.8mm SAC.

https://www.microchip.com

WFBGA - Microchip Technology

For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. Note: 128-Ball Very ...

https://www.microchip.com

封裝服務- Package Characterization ... - 菱生精密工業股份有限公司

Lingsen' WFBGA (Very-Very Fine Ball Grid Array) is the thinner package solution for mobile applications, All non-Pb (lead-free) devices are RoHS compliant.

http://www.lingsen.com.tw